Job Description
Assembly Engineer 2 - 110190
Job
: Packaging/Assembly Engineer
Primary Location
: MYS-Malaysia-Malaysia
Description
Manage IC assembly process engineering to ensure stable supply chain of quality IC products. Assembly Resident Engineer will be responsible to monitor, analyze, and improve the Assembly Yield and Quality. He/she will also be responsible to review and improve process controls, participate in the device/package/site qualification, participate in the supplier audit/s, initiate/lead continuous improvement projects, and analyze/resolve quality issues.
Qualifications
§Bachelor's degree in EE, ECE, ChE, MetE, MatE, ME or CoE
§With at least 5 years of relevant work experience in IC Assembly process engineering
§Preferably with Wirebond Process Expertise
§With working knowledge in Design of Experiment, FMEA, 8D, SPC, Problem Solving
Techniques, and Project Management
§Good written and verbal communication, computer and presentation skills
§Highly motivated, keen with details, team player and with good leadership qualities
Mandarin speaking is an advantage
Schedule: Full-time
Education Level: Associate's Degree/College Diploma (±13 years)
Employee Status : Regular
Travel : Yes, 10% of the time
Job Level : Individual Contributor
Job Type : Experienced
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